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  1. SOP-8 - Toshiba Electronic Devices & Storage Corporation

    On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOP-8 package.

  2. How to Use SOP8: Examples, Pinouts, and Specs - Cirkit Designer

    The SOP8 (Small Outline Package 8) is a surface-mount integrated circuit (IC) package with eight pins. It is widely used in modern electronics due to its compact size, lightweight design, and efficient …

  3. SOP8 Small Reel Package Information Datasheet by Rohm …

    View SOP8 Small Reel Package Information by Rohm Semiconductor datasheet for technical specifications, dimensions and more at DigiKey.

  4. SOP8 Datasheet (PDF) - Rohm

    ROHM Semiconductor is a Japanese semiconductor company that was founded in 1958. The company specializes in the design and manufacture of a wide range of products including power management, …

  5. SOP8 | Packages - Nisshinbo Micro Devices

    Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern)) Package information.

  6. latest specifica-tions : Although ROHM is continuously working to improve product reliability and quality, semicon-ductors can break down and malfunct.

  7. SOP-8 N-Channel MOSFETs – Mouser

    Mouser offers inventory, pricing, & datasheets for SOP-8 N-Channel MOSFETs.

  8. SOP.8package products pinout, dimensions ... - Jotrin Electronics

    The SOP.8 (Small Outline Package, 8-lead) is a surface-mount package designed for high-density circuits. Featuring a compact gull-wing lead design, standardized JEDEC outline, and 8-lead …

  9. SOP8 SSOP8 TSSOP8 SMD To DIP8 Adapter - Electrobes

    It is compatible with 2 to 8 pins (6 pins, 4 pins). A side for pin pitch size 1.27mm, it can be used for most of the SO, SOP, SOIC to 2.54mm DIP. B side for pin pitch size 0.65mm, it can be used for most of …

  10. SOP - SOP8 package products list | Xecor

    Designed for thermal efficiency and minimal footprint, this 8-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.