Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...

As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvilinear-native data flows to keep turn ...

Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”.

Exhaustive proofs are the only way to find deep corner-case bugs that can result in deadlocks and silent data corruption.

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Compromise ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...