Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...

– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for advanced semiconductor applications.

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...

US-based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have announced a new cells record of 20.3% using direct wafer technology. The pair also ...

ChipPac Inc. today said it has qualified all the front-end assembly operations required to allow packaging of chips from 300mm wafers. Newly qualified processes include thinning the 300mm wafers to ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...