Benefits derived from numerical simulation Evaluating and validating the performance of an LED via simulation and cooling strategies. How to perform CHT simulation. The global electronics industry ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Even with robotics, traditional development and production are time-consuming and error-prone. You can optimize downstream workflows with computer-aided design (CAD) and computer-aided engineering ...

French scientists have developed a fully coupled opto-electro-thermal model that reportedly predicts solar cell behavior under real operating conditions in a standalone framework. They said the model ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...