The adhesion of dielectric thin films has presented a major obstacle for interconnect integration and dependability. Issues such as film adhesion failures, reduced dielectric film mechanical integrity ...

Photosensitive polymer films are commonly utilized as a dielectric layer in microelectronics packaging. The performance of the organic film is determined by the adhesion quality between the polymer ...

What is the role of imec in semiconductor technology, and what are the unique assets it offers to partner companies? Imec is recognized worldwide as a research and development (R&D) hub undertaking ...