Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...
The 100% lead-free OptiMO T2 power MOSFET from Infineon Technologies is qualified for automotive applications. Based on the company’s thin wafer process technology, the 40-V device is produced using a ...
DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...
Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction ...
High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...
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